It is the device to analyze the resin hardening properties of composite material, to check heating response during hardening. By providing dedicated soft ware connected to computer, Data saving is very convenient.

• It is the device to measure the hardening properties of Epoxy/ SMC Compound / BMC materials.
• It can check exothermic reaction, starting temperature of material demonstrated during hardening and Isothermal / heating hardening reaction.
• It can save the curve of hardening properties in computer and communication.
• It has high performance and high price competitiveness compared with foreign device.